- 封装:8-SOIC(0.154",3.90mm 宽)
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:管件
- 参考价格:$1.125-$2.79
更新日期:2024-04-01 00:04:00
产品简介:单路 P 通道增强-模式 MOSFET
查看详情- 封装:8-SOIC(0.154",3.90mm 宽)
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:管件
- 参考价格:$1.125-$2.79
TPS1101D 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI
-
-
8 -
1284
-
杭州
-
-
-
原装正品现货
-
Ti
-
-
2019+ -
5800
-
上海市
-
-
-
全新原装现货
-
TI(德州仪器)
-
SOIC-8
2022+ -
12000
-
上海市
-
-
-
原装可开发票
-
TI
-
SOP8
23+ -
5800
-
上海市
-
-
-
进口原装现货,杜绝假货。
-
TI/德州仪器
-
SOP8
21+ -
10000
-
杭州
-
-
-
只做原装现货,大量现货热卖
TPS1101D 中文资料属性参数
- 标准包装:75
- 类别:分离式半导体产品
- 家庭:FET - 单
- 系列:-
- FET 型:MOSFET P 通道,金属氧化物
- FET 特点:逻辑电平门
- 漏极至源极电压(Vdss):15V
- 电流 - 连续漏极(Id) @ 25° C:2.3A
- 开态Rds(最大)@ Id, Vgs @ 25° C:90 毫欧 @ 2.5A,10V
- Id 时的 Vgs(th)(最大):1.5V @ 250µA
- 闸电荷(Qg) @ Vgs:11.25nC @ 10V
- 输入电容 (Ciss) @ Vds:-
- 功率 - 最大:791mW
- 安装类型:表面贴装
- 封装/外壳:8-SOIC(0.154",3.90mm 宽)
- 供应商设备封装:8-SOIC
- 包装:管件
- 其它名称:296-3381-5
产品特性
- Low rDS(on) . . . 0.09 Typ at VGS = -10 V
- 3 V Compatible
- Requires No External VCC
- TTL and CMOS Compatible Inputs
- VGS(th) = -1.5 V Max
- Available in Ultrathin TSSOP Package (PW)
- ESD Protection Up to 2 kV per MIL-STD-883C, Method 3015
产品概述
The TPS1101 is a single, low-rDS(on), P-channel, enhancement-mode MOSFET. The device has been optimized for 3-V or 5-V power distribution in battery-powered systems by means of the Texas Instruments LinBiCMOSTM
process. With a maximum VGS(th) of -1.5 V and an IDSS of only 0.5 uA, the TPS1101 is the ideal high-side switch for low-voltage, portable battery-management systems where maximizing battery life is a primary concern. The low rDS(on) and excellent ac characteristics (rise time 5.5 ns typical) of the TPS1101 make it the logical choice for low-voltage switching applications such as power switches for pulse-width-modulated (PWM) controllers or motor/bridge drivers.
The ultrathin thin shrink small-outline package or TSSOP (PW) version fits in height-restricted places where other P-channel MOSFETs cannot. The size advantage is especially important where board height restrictions do not allow for an small-outline integrated circuit (SOIC) package. Such applications include notebook computers, personal digital assistants (PDAs), cellular telephones, and PCMCIA cards. For existing designs, the D-packaged version has a pinout common with other P-channel MOSFETs in SOIC packages.
TPS1101D 数据手册
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