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  • 封装:56-TFSOP(0.240",6.10mm 宽)
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$1.8-$3.6

更新日期:2024-04-01 00:04:00

产品简介:具有三态输出的 3.3V ABT 18 位通用总线收发器

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  • 封装:56-TFSOP(0.240",6.10mm 宽)
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$1.8-$3.6

SN74LVT16501DGGR 供应商

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  • 型号
  • 品牌
  • 封装/批号
  • 数量
  • 地区
  • 日期
  • 说明
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SN74LVT16501DGGR 中文资料属性参数

  • 标准包装:1
  • 类别:集成电路 (IC)
  • 家庭:逻辑 - 通用总线函数
  • 系列:74LVT
  • 逻辑类型:通用总线收发器
  • 输入数:-
  • 电路数:18 位
  • 输出电流高,低:32mA,64mA
  • 电源电压:2.7 V ~ 3.6 V
  • 工作温度:-40°C ~ 85°C
  • 安装类型:表面贴装
  • 封装/外壳:56-TFSOP(0.240",6.10mm 宽)
  • 供应商设备封装:56-TSSOP
  • 包装:®
  • 其它名称:296-1252-6

产品特性

  • State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low-Static Power Dissipation
  • Members of the Texas Instruments WidebusTM Family
  • Support Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Support Unregulated Battery Operation Down to 2.7 V
  • UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25°C
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Support Live Insertion
  • Distributed VCC and GND Pin Configuration Minimizes High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

产品概述

The 'LVT16501 are 18-bit universal bus transceivers designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.Data flow in each direction is controlled by output-enable (OEAB and ), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the devices operate in the transparent mode when LEAB is high. When LEAB is low, the A data is latched if CLKAB is held at a high or low logic level. If LEAB is low, the A-bus data is stored in the latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is high, the outputs are active. When OEAB is low, the outputs are in the high-impedance state. Data flow for B to A is similar to that of A to B but uses , LEBA, and CLKBA. The output enables are complementary (OEAB is active high and is active low).Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.To ensure the high-impedance state during power up or power down, should be tied to VCC through a pullup resistor. The minimum value of the resistor is determined by the current-sinking capability of the driver. OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.The SN74LVT16501 is available in TI's shrink small-outline (DL) and thin shrink small-outline (DGG) packages, which provide twice the input/output (I/O) pin count and functionality of standard small-outline packages in the same printed circuit board area.The SN54LVT16501 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74LVT16501 is characterized for operation from -40°C to 85°C.   

SN74LVT16501DGGR 数据手册

数据手册 说明 数量 操作
SN74LVT16501DGGR

3.3-V ABT 18-BIT UNIVERSAL BUS TRANSCEIVERS WITH 3-STATE OUTPUTS

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