- 封装:56-BSSOP(0.295",7.50mm 宽)
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
更新日期:2024-04-01
产品简介:具有三态输出的 18 位通用总线收发器
查看详情- 封装:56-BSSOP(0.295",7.50mm 宽)
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
SN74ABT16501DLR 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
SN74ABT16501DLR 中文资料属性参数
- 标准包装:1
- 类别:集成电路 (IC)
- 家庭:逻辑 - 通用总线函数
- 系列:74ABT
- 逻辑类型:通用总线收发器
- 输入数:-
- 电路数:18 位
- 输出电流高,低:32mA,64mA
- 电源电压:4.5 V ~ 5.5 V
- 工作温度:-40°C ~ 85°C
- 安装类型:表面贴装
- 封装/外壳:56-BSSOP(0.295",7.50mm 宽)
- 供应商设备封装:56-SSOP
- 包装:®
- 其它名称:296-1031-6
产品特性
- Members of the Texas Instruments WidebusTM Family
- State-of-the-Art EPIC-IIBTM BiCMOS Design Significantly Reduces Power Dissipation
- UBTTM (Universal Bus Transceiver) Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
- ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
- Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
- Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 5 V, TA = 25°C
- Flow-Through Architecture Optimizes PCB Layout
- Package Options Include Plastic 300-mil Shrink Small-Outline (DL) and Thin Shrink Small-Outline (DGG) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings
产品概述
These 18-bit universal bus transceivers consist of storage
elements that can operate either as D-type latches or D-type
flip-flops to allow data flow in transparent or clocked modes.Data flow in each direction is controlled by output-enable (OEAB
and ), latch-enable
(LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data
flow, the device operates in the transparent mode when LEAB is high.
When LEAB is low, the A data is latched if CLKAB is held at a high or
low logic level. If LEAB is low, the A data is stored in the
latch/flip-flop on the low-to-high transition of CLKAB. When OEAB is
high, the outputs are active. When OEAB is low, the outputs are in
the high-impedance state.Data flow for B to A is similar to that of A to B but uses, LEBA, and CLKBA. The output
enables are complementary (OEAB is active high and is active low).To ensure the high-impedance state during power up or power down,
OE should be tied to GND through a pulldown resistor and should be tied to VCC
through a pullup resistor; the minimum value of the resistor is
determined by the current-sourcing/current-sinking capability of the
driver. The SN54ABT16501 is characterized for operation over the full
military temperature range of -55°C to 125°C. The
SN74ABT16501 is characterized for operation from -40°C to
85°C.
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