CC2560BYFVR_CC2560BYFVR中文资料_价格

CC2560BYFVR 供应商

公司
型号
品牌
封装/批号
数量
地区
日期
说明
询价

上海三崧电子有限公司 保2千
CC2560BYFVR
TI
原厂原装
22+
3288
上海市
-
一级代理原装

上海德懿电子科技有限公司
CC2560BYFVR
TI
DSBGA
21+
20000
上海市
-
原装现货!品质为先！请来电垂询！

CC2560BYFVR 中文资料属性参数

现有数量：0现货查看交期
价格：2,500 : ￥23.65891卷带（TR）
系列：-
包装：卷带（TR）
产品状态：在售
类型：仅限 TxRx
射频系列/标准：蓝牙
协议：蓝牙 v4.1
调制：GFSK，GMSK
频率：2.4GHz
数据速率（最大值）：4Mbps
功率 - 输出：12dBm
灵敏度：-95dBm
存储容量：-
串行接口：I2S，UART
GPIO：-
电压 - 供电：2.2V ~ 4.8V
电流 - 接收：40.5mA ~ 41.2mA
电流 - 传输：40.5mA ~ 41.2mA
工作温度：-40°C ~ 85°C
安装类型：表面贴装型
封装/外壳：54-UFBGA，DSBGA
供应商器件封装：54-DSBGA（2.93x3.27）

产品特性

TI’s Single-Chip Bluetooth Solution With Bluetooth Basic Rate (BR), Enhanced Data Rate (EDR), and Low Energy (LE) Support; Available in Two Variants: Dual-Mode Bluetooth CC2564 Controller Bluetooth CC2560 Controller
Dual-Mode Bluetooth CC2564 Controller
Bluetooth CC2560 Controller
CC2564 Bluetooth 4.1 Controller Subsystem Qualified (QDID 58852); Compliant up to the HCI Layer
Highly Optimized for Low-Cost Designs: Single-Ended 50-Ω RF Interface Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm x 8-mm mrQFN
Single-Ended 50-Ω RF Interface
Package Footprint: 76 Terminals, 0.6-mm Pitch, 8-mm x 8-mm mrQFN
BR/EDR Features Include: Up to 7 Active Devices Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves Up to 2 SCO Links on the Same Piconet Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded) CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power Support of Multiple Bluetooth Profiles With Enhanced QoS
Up to 7 Active Devices
Scatternet: Up to 3 Piconets Simultaneously, 1 as Master and 2 as Slaves
Up to 2 SCO Links on the Same Piconet
Support for All Voice Air-Coding – Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
CC2560B/CC2564B Devices Provide an Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
Support of Multiple Bluetooth Profiles With Enhanced QoS
LE Features Include: Support of Up to 10 (CC2564B) Connections Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance. Built-In Coexistence and Prioritization Handling for BR/EDR and LE
Support of Up to 10 (CC2564B) Connections
Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
Independent Buffering for LE Allows Large Numbers of Multiple Connections Without Affecting BR/EDR Performance.
Built-In Coexistence and Prioritization Handling for BR/EDR and LE
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking) Class 1 TX Power Up to +10 dBm –95 dbm Typical RX Sensitivity Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time Provides Longer Range, Including 2x Range Over Other LE-Only Solutions
Class 1 TX Power Up to +10 dBm
–95 dbm Typical RX Sensitivity
Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
Provides Longer Range, Including 2x Range Over Other LE-Only Solutions
Advanced Power Management for Extended Battery Life and Ease of Design On-Chip Power Management, Including Direct Connection to Battery Low Power Consumption for Active, Standby, and Scan Bluetooth Modes Shutdown and Sleep Modes to Minimize Power Consumption
On-Chip Power Management, Including Direct Connection to Battery
Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
Shutdown and Sleep Modes to Minimize Power Consumption
Physical Interfaces: UART Interface With Support for Maximum Bluetooth Data Rates UART Transport Layer (H4) With Maximum Rate of 4 Mbps Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only) Fully Programmable Digital PCM-I2S Codec Interface
UART Interface With Support for Maximum Bluetooth Data Rates UART Transport Layer (H4) With Maximum Rate of 4 Mbps Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only)
UART Transport Layer (H4) With Maximum Rate of 4 Mbps
Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps (CC2560B and CC2564B Only)
Fully Programmable Digital PCM-I2S Codec Interface
Flexibility for Easy Stack Integration and Validation Into Various Microcontrollers, Such as MSP430™ and ARM® Cortex®-M3 and Cortex®-M4 MCUs
CC256x Bluetooth Hardware Evaluation Tool: PC- Based Application to Evaluate RF Performance of the Device and Configure Service Pack
Device Pin-to-Pin Compatible With Previous Devices or Modules

产品概述

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

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