- 封装:20-XFBGA,DSBGA
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.8195-$1.75
更新日期:2024-04-01 00:04:00
产品简介:具有 ESD 保护和 EMI 滤波的 MMC、SD 卡、记忆棒电压转换收发器
查看详情- 封装:20-XFBGA,DSBGA
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.8195-$1.75
TXS0206YFPR 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI
-
DSBGA20
新批号 -
887000
-
上海市
-
-
-
原厂发货进口原装微信同步QQ893727827
-
TI
-
DSBGA20
23+ -
46000
-
合肥
-
-
-
科大讯飞战略投资企业,提供一站式配套服务
TXS0206YFPR 中文资料属性参数
- 视频文件:TXS0206 Voltage Level Translator
- 标准包装:1
- 类别:集成电路 (IC)
- 家庭:逻辑 - 变换器
- 系列:-
- 逻辑功能:变换器
- 位数:4
- 输入类型:电压
- 输出类型:电压
- 数据速率:60Mbps
- 通道数:4
- 输出/通道数目:1
- 差分 - 输入:输出:无/无
- 传输延迟(最大):3.7ns
- 电源电压:1.1 V ~ 3.6 V
- 工作温度:-40°C ~ 85°C
- 封装/外壳:20-XFBGA,DSBGA
- 供应商设备封装:20-DSBGA(1.96x1.56)
- 包装:Digi-Reel®
- 其它名称:296-24274-6
产品特性
- Level Translator VCCA and VCCB Range of 1.1 V to 3.6 V Fast Propagation Delay (4 ns Max When Translating Between 1.8 V and 3 V)
- VCCA and VCCB Range of 1.1 V to 3.6 V
- Fast Propagation Delay (4 ns Max When Translating Between 1.8 V and 3 V)
- Integrated EMI Filtering and ESD Protection Circuitry
- ESD Protection Exceeds JESD 22 (A Port) 2500-V Human-Body Model (A114-B) 250-V Machine Model (A115-A) 1500-V Charged-Device Model (C101)
- 2500-V Human-Body Model (A114-B)
- 250-V Machine Model (A115-A)
- 1500-V Charged-Device Model (C101)
- ±8-kV Contact Discharge IEC 61000-4-2 ESD (B-port)
产品概述
The TXS0206 is a level shifter for interfacing microprocessors with MultiMediaCards (MMCs), secure digital (SD) cards, and Memory Stick™ cards. It includes a high-speed level translator along with ESD protection and EMI filtering circuitry.The voltage-level translator has two supply voltage pins. VCCA as well as VCCB can be operated over the full range of 1.1 V to 3.6 V. The TXS0206 enables system designers to easily interface applications processors or digital basebands to memory cards and SDIO peripherals operating at a different I/O voltage level.Memory card standards recommend high-ESD protection for devices that connect directly to the external memory card. To meet this need, the TXS0206 incorporates ±8-kV Contact Discharge protection on the card side.The TXS0206 is offered in a 20-bump wafer chip scale package (WCSP). This package has dimensions of 1.96 mm × 1.56 mm, with a 0.4-mm ball pitch for effective board-space savings. Memory cards are widely used in mobile phones, PDAs, digital cameras, personal media players, camcorders, set-top boxes, etc. Low static power consumption and small package size make the TXS0206 an ideal choice for these applications.
TXS0206YFPR 相关产品
- 100324QC
- 100324SC
- 100325QC
- 100395QC
- 74ALVC164245DGG:11
- 74ALVC164245DGGRE4
- 74ALVC164245DGGRG4
- 74ALVC164245DGGTE4
- 74ALVC164245DGGTG4
- 74ALVC164245DL,118
- 74ALVC164245DLG4
- 74ALVC164245DLRG4
- 74AVC16T245DGVRE4
- 74AVC4T245BQ,115
- 74AVC4T245DGVRE4
- 74AVC4T245PW,118
- 74AVC4T245QRGYRQ1
- 74AVC4T245RGYRG4
- 74AVC4T245RSVRG4
- 74AVC4T774RSVRG4
- 74AVC8T245BQ,118
- 74AVC8T245RHLRG4
- 74AVCA164245GRE4
- 74AVCAH164245ZQLR
- 74AVCB164245GRE4
- 74AVCBH164245ZQLR
- 74AVCH1T45DBVRE4
- 74AVCH1T45DBVRG4
- 74AVCH1T45DCKRE4
- 74AVCH1T45DCKRG4

搜索
发布采购