您好,欢迎来到知芯网
  • 封装:24-TSSOP(0.173",4.40mm 宽)
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:管件
  • 参考价格:$4.305

更新日期:2024-04-01 00:04:00

产品简介:GTLP 到 LVTTL 1 至 6 驱动器

查看详情
  • 封装:24-TSSOP(0.173",4.40mm 宽)
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:管件
  • 参考价格:$4.305

SN74GTLP817PW 供应商

  • 公司
  • 型号
  • 品牌
  • 封装/批号
  • 数量
  • 地区
  • 日期
  • 说明
  • 询价

SN74GTLP817PW 中文资料属性参数

  • 标准包装:60
  • 类别:集成电路 (IC)
  • 家庭:逻辑 - 变换器
  • 系列:74GTLP
  • 逻辑功能:变换器,双向
  • 位数:6
  • 输入类型:GTLP
  • 输出类型:LVTTL
  • 数据速率:-
  • 通道数:1
  • 输出/通道数目:6
  • 差分 - 输入:输出:无/无
  • 传输延迟(最大):4.2ns
  • 电源电压:3.15 V ~ 3.45 V
  • 工作温度:-40°C ~ 85°C
  • 封装/外壳:24-TSSOP(0.173",4.40mm 宽)
  • 供应商设备封装:24-TSSOP
  • 包装:管件

产品特性

  • OEC™ Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference
  • Bidirectional Interface Between GTLP Signal Levels and LVTTL Logic Levels
  • GTLP-to-LVTTL 1-to-6 Fanout Driver
  • LVTTL-to-GTLP 1-to-2 Fanout Driver
  • LVTTL Interfaces Are 5-V Tolerant
  • Medium-Drive GTLP Outputs (50 mA)
  • Reduced-Drive LVTTL Outputs (\x9612 mA/12 mA)
  • Variable Edge-Rate Control (ERC) Input Selects GTLP Rise and Fall Times for Optimal Data-Transfer Rate and Signal Integrity in Distributed Loads
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

产品概述

The SN74GTLP817 is a medium-drive fanout driver that provides LVTTL-to-GTLP and GTLP-to-LVTTL signal-level translation. The device provides a high-speed interface between cards operating at LVTTL logic levels and a backplane operating at GTLP signal levels. High-speed (about three times faster than standard TTL or LVTTL) backplane operation is a direct result of GTLP reduced output swing (<1 V), reduced input threshold levels, improved differential input, and OEC™ circuitry. The improved GTLP OEC circuitry minimizes bus settling time and has been designed and tested using several backplane models. The medium drive allows incident-wave switching in heavily loaded backplanes with equivalent load impedance down to 19 . BO1 and BO2 can be tied together to drive an equivalent load impedance down to 11 . GTLP is the Texas Instruments (TI™) derivative of the Gunning Transceiver Logic (GTL) JEDEC standard JESD 8-3. The ac specification of the SN74GTLP817 is given only at the preferred higher noise-margin GTLP, but the user has the flexibility of using this device at either GTL (VTT = 1.2 V and V REF = 0.8 V) or GTLP (VTT = 1.5 V and VREF = 1 V) signal levels. Normally, the B port operates at GTLP signal levels. The A-port and control inputs operate at LVTTL logic levels but are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs. VREF is the B-port differential input reference voltage. GNDT is the TTL output ground, while GNDG is the GTLP output ground, and both may be separated from each other for a quieter device. This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. This device features adjustable edge-rate control (ERC). Changing the ERC input voltage between GND and VCC adjusts the B-port output rise and fall times. This allows the designer to optimize system data-transfer rate and signal integrity to the backplane load. ERC automatically is selected to the same speed as alternate source 1-to-6 fanout drivers that use pin 18 for 3.3-V or 5-V VCC . When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, the output-enable (OE\) input should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

IC 索引: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9