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  • 封装:8-XFBGA,DSBGA
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.2475-$0.62

更新日期:2024-04-01 00:04:00

产品简介:具有三态输出的 2 通道、0.8V 至 3.6V 低功耗缓冲器

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  • 封装:8-XFBGA,DSBGA
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.2475-$0.62

SN74AUP2G126YFPR 供应商

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SN74AUP2G126YFPR 中文资料属性参数

  • 标准包装:1
  • 类别:集成电路 (IC)
  • 家庭:逻辑 - 缓冲器,驱动器,接收器,收发器
  • 系列:74AUP
  • 逻辑类型:缓冲器/线路驱动器,非反相
  • 元件数:2
  • 每个元件的位元数:1
  • 输出电流高,低:4mA,4mA
  • 电源电压:0.8 V ~ 3.6 V
  • 工作温度:-40°C ~ 85°C
  • 安装类型:表面贴装
  • 封装/外壳:8-XFBGA,DSBGA
  • 供应商设备封装:8-DSBGA(1.6x0.8)
  • 包装:®
  • 其它名称:296-24737-6

产品特性

  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption (ICC = 0.9 µA Max)
  • Low Dynamic-Power Consumption (Cpd = 4 pF Typ at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typ)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Input-Disable Feature Allows Floating Input Conditions
  • Ioff Supports Partial-Power-Down Mode Operation
  • Input Hysteresis Allows Slow Input Transition and Better Switching Noise Immunity at Input
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 9.9 ns Max at 3.3 V
  • Suitable for Point-to-Point Applications
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22 2000-V Human-Body Model (A114-B, Class II) 1000-V Charged-Device Model (C101)
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)

产品概述

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static and dynamic power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in an increased battery life. This product also maintains excellent signal integrity (see Figure 1 and Figure 2).The SN74AUP2G126 is a dual bus driver/line driver with 3-state outputs, designed for 0.8-V to 3.6-V VCC operation. The outputs are disabled when the associated output-enable (OE) input is low. This device has the input-disable feature, which allows floating input signals.To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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