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  • 封装:4-XFBGA,DSBGA
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.189-$0.53

更新日期:2024-04-01 00:04:00

产品简介:具有施密特触发输入的单路 0.8V 至 3.6V 低功耗缓冲器

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  • 封装:4-XFBGA,DSBGA
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.189-$0.53

SN74AUP1G17YFPR 供应商

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SN74AUP1G17YFPR 中文资料属性参数

  • 标准包装:1
  • 类别:集成电路 (IC)
  • 家庭:逻辑 - 缓冲器,驱动器,接收器,收发器
  • 系列:74AUP
  • 逻辑类型:施密特触发器 - 缓冲器,驱动器
  • 元件数:1
  • 每个元件的位元数:1
  • 输出电流高,低:4mA,4mA
  • 电源电压:0.8 V ~ 3.6 V
  • 工作温度:-40°C ~ 85°C
  • 安装类型:表面贴装
  • 封装/外壳:4-XFBGA,DSBGA
  • 供应商设备封装:4-DSBGA(0.8x0.8)
  • 包装:®
  • 其它名称:296-25200-6

产品特性

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 222000-V Human-Body Model (A114-B, Class II)1000-V Charged-Device Model (C101)
  • 2000-V Human-Body Model (A114-B, Class II)
  • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoStar™ Package
  • Low Static-Power Consumption (ICC = 0.9 µA Maximum)
  • Low Dynamic-Power Consumption (Cpd = 4.4 pF Typical at 3.3 V)
  • Low Input Capacitance (Ci = 1.5 pF Typical)
  • Low Noise – Overshoot and Undershoot <10% of VCC
  • Ioff Supports Partial-Power-Down Mode Operation
  • Includes Schmitt-Trigger Inputs
  • Wide Operating VCC Range of 0.8 V to 3.6 V
  • Optimized for 3.3-V Operation
  • 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • tpd = 5.1 ns Maximum at 3.3 V
  • Suitable for Point-to-Point Applications

产品概述

The AUP family of devices is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life. This product also maintains excellent signal integrity (see AUP – The Lowest-Power Family and Excellent Signal Integrity).This device functions as an independent gate with Schmitt-trigger inputs, which allows for slow input transition and better switching-noise immunity at the input.NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs when the device is powered down. This inhibits current backflow into the device which prevents damage to the device.

SN74AUP1G17YFPR 电路图

SN74AUP1G17YFPR 电路图

SN74AUP1G17YFPR 电路图

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