CC2564MODNCMOET_CC2564MODNCMOET中文资料_价格

CC2564MODNCMOET 供应商

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上海三崧电子有限公司 保2千
CC2564MODNCMOET
TI
原厂原装
22+
3288
上海市
-
一级代理原装

CC2564MODNCMOET 中文资料属性参数

现有数量：0现货查看交期
价格：1 : ￥90.32000剪切带（CT）250 : ￥64.49140卷带（TR）
系列：-
包装：卷带（TR）剪切带（CT）? 得捷定制卷带
产品状态：在售
射频系列/标准：蓝牙
协议：蓝牙 v4.1
调制：-
频率：2.4GHz
数据速率：4Mbps
功率 - 输出：10dBm
灵敏度：-93dBm
串行接口：I2S，UART
天线类型：不含天线
使用的 IC/零件：CC2564
存储容量：-
电压 - 供电：2.2V ~ 4.8V
电流 - 接收：112.5mA
电流 - 传输：112.5mA
安装类型：表面贴装型
工作温度：-30°C ~ 85°C
封装/外壳：33-SMD 模块

产品特性

Module Solution Based on TI's CC2564B Dual-Mode Bluetooth®, Available in Two Variants: CC2564MODA With Integrated Antenna CC2564MODN With External Antenna
CC2564MODA With Integrated Antenna
CC2564MODN With External Antenna
Fully Certified Module for FCC, IC, CE, and Bluetooth 4.1 FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2) CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3) Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
FCC (Z64-2564N), IC (451I-2564N) Modular Grant (see Section 6.2.1.3, Section 7.1.1, and Section 7.1.2)
CE Certified as Summarized in the Declaration of Conformity (see Section 7.1.3)
Bluetooth 4.1 Controller Subsystem Qualified (CC2564MODN: QDID 55257; CC2564MODA: QDID 64631). Compliant up to the HCI Layer
Highly Optimized for Design Into Small Form Factor Systems and Flexibility: CC2564MODA Integrated Chip Antenna Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical) CC2564MODN Single-Ended 50-Ω RF Interface Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
CC2564MODA Integrated Chip Antenna Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
Integrated Chip Antenna
Module Footprint: 35 Terminals, 0.8-mm Pitch, 7 mm × 14 mm × 1.4 mm (Typical)
CC2564MODN Single-Ended 50-Ω RF Interface Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
Single-Ended 50-Ω RF Interface
Module Footprint: 33 Terminals, 0.8-mm Pitch, 7 mm × 7 mm × 1.4 mm (Typical)
BR and EDR Features Include: Up to Seven Active Devices Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded) Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power Support of Multiple Bluetooth Profiles With Enhanced QoS
Up to Seven Active Devices
Scatternet: Up to Three Piconets Simultaneously, One as Master and Two as Slaves
Up to Two Synchronous Connection Oriented (SCO) Links on the Same Piconet
Support for All Voice Air-Coding—Continuously Variable Slope Delta (CVSD), A-Law, µ-Law, and Transparent (Uncoded)
Assisted Mode for HFP 1.6 Wideband Speech (WBS) Profile or A2DP Profile to Reduce Host Processing and Power
Support of Multiple Bluetooth Profiles With Enhanced QoS
Low Energy Features Include: Support of up to 10 Simultaneous Connections Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
Support of up to 10 Simultaneous Connections
Multiple Sniff Instances Tightly Coupled to Achieve Minimum Power Consumption
Independent Buffering for Low Energy Allows Large Numbers of Multiple Connections Without Affecting BR or EDR Performance
Built-In Coexistence and Prioritization Handling for BR, EDR, and Low Energy
Best-in-Class Bluetooth (RF) Performance (TX Power, RX Sensitivity, Blocking) Class 1.5 TX Power up to +10 dBm –93 dbm Typical RX Sensitivity Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
Class 1.5 TX Power up to +10 dBm
–93 dbm Typical RX Sensitivity
Internal Temperature Detection and Compensation to Ensure Minimal Variation in RF Performance Over Temperature, No External Calibration Required
Improved Adaptive Frequency Hopping (AFH) Algorithm With Minimum Adaptation Time
Provides Longer Range, Including Twice the Range of Other Low-Energy-Only Solutions
Advanced Power Management for Extended Battery Life and Ease of Design On-Chip Power Management, Including Direct Connection to Battery Low Power Consumption for Active, Standby, and Scan Bluetooth Modes Shutdown and Sleep Modes to Minimize Power Consumption
On-Chip Power Management, Including Direct Connection to Battery
Low Power Consumption for Active, Standby, and Scan Bluetooth Modes
Shutdown and Sleep Modes to Minimize Power Consumption
Physical Interfaces: UART Interface With Support for Maximum Bluetooth Data Rates UART Transport Layer (H4) With Maximum Rate of 4 Mbps Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
UART Interface With Support for Maximum Bluetooth Data Rates UART Transport Layer (H4) With Maximum Rate of 4 Mbps Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
UART Transport Layer (H4) With Maximum Rate of 4 Mbps
Three-Wire UART Transport Layer (H5) With Maximum Rate of 4 Mbps
Fully Programmable Digital Pulse-Code Modulation (PCM)–I2S Codec Interface
CC256x Bluetooth Hardware Evaluation Tool: PC-Based Application to Evaluate RF Performance of the Device and Configure Service Pack

产品概述

The CC2564MODx module from Texas Instruments™ is a complete Bluetooth® BR/EDR, and low energy HCI solution that reduces design effort, cost, and time to market. The CC2564MODx module includes TI's seventh-generation core and provides a versatile, product-proven solution that is Bluetooth 4.1-compliant. The module is also certified for FCC, IC, and CE, requiring no prior RF experience to develop with this device; and the device includes a royalty-free software stack compatible with several host MCUs and MPUs. The CC2564MODx module provides best-in-class RF performance with transmit power and receive sensitivity that provides twice the range and higher throughput than other Bluetooth-low-energy-only solutions.Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR and low energy modes of operation.The TI dual-mode Bluetooth stack software is certified and provided royalty free for TI's MSP430™ and MSP432™ ARM® Cortex®-M3 and ARM® Cortex®-M4 MCUs, and Linux® based MPUs. Other processors can be supported through TI's third party. The iPod® (MFi) protocol is supported by add-on software packages. Multiple profiles and sample applications, including the following, are supported:For more information, see TI Dual-Mode Bluetooth Stack.In addition to software, the BOOST-CC2564MODA and CC2564MODxEM evaluation boards are available for each variant. For more information on TI’s wireless platform solutions for Bluetooth, see TI's wireless-connectivity/dual-mode-bluetooth page.

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CC2564MODNCMOET 数据手册

数据手册	说明	数量	操作
CC2564MODNCMOET	RF TXRX MODULE BLUETOOTH	62页,16.43M	查看

CC2564MODNCMOET 电路图