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  • 封装:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.6634-$1.55

更新日期:2024-04-01 00:04:00

产品简介:采用 BGA 封装的 700mW 单声道、模拟输入 AB 类音频放大器

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  • 封装:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.6634-$1.55

TPA751DGNR 供应商

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  • 型号
  • 品牌
  • 封装/批号
  • 数量
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TPA751DGNR 中文资料属性参数

  • 标准包装:1
  • 类别:集成电路 (IC)
  • 家庭:线性 - 音頻放大器
  • 系列:-
  • 类型:AB 类
  • 输出类型:1-通道(单声道)
  • 在某负载时最大输出功率 x 通道数量:700mW x 1 @ 8 欧姆
  • 电源电压:2.5 V ~ 5.5 V
  • 特点:差分输入,短路保护和热保护,关机
  • 安装类型:表面贴装
  • 供应商设备封装:8-MSOP-PowerPad
  • 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
  • 包装:®
  • 配用:296-13570-ND - EVAL MOD FOR TPA751
  • 其它名称:296-10856-6

产品特性

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Power Supply Rejection at 217 Hz 84 dB at VDD = 5 V 81 dB at VDD = 3.3 V
  • 84 dB at VDD = 5 V
  • 81 dB at VDD = 3.3 V
  • Output Power for RL = 8 700 mW at VDD = 5 V 250 mW at VDD = 3.3 V
  • 700 mW at VDD = 5 V
  • 250 mW at VDD = 3.3 V
  • Ultralow Supply Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging SOIC PowerPAD™ MSOP MicroStar Junior™ (BGA)
  • SOIC
  • PowerPAD™ MSOP
  • MicroStar Junior™ (BGA)

产品概述

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior™ (BGA), 8-pin SOIC surface-mount package and a surface-mount PowerPAD™ MSOP.

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