- 封装:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.6634-$1.55
更新日期:2024-04-01 00:04:00
产品简介:700mW 单声道、模拟输入 AB 类音频放大器
查看详情- 封装:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.6634-$1.55
TPA721DGNR 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI/德州仪器
-
MSOP8
2024 -
91752
-
上海市
-
-
-
上海原装现货库存,欢迎咨询合作
-
TI
-
MSOP
2 -
600
-
杭州
-
-
-
原装正品现货
-
TI
-
-
2019+ -
5800
-
上海市
-
-
-
全新原装现货
-
TI
-
-
21+ -
7500
-
上海市
-
-
-
原装现货,品质为先!请来电垂询!
TPA721DGNR 中文资料属性参数
- 标准包装:1
- 类别:集成电路 (IC)
- 家庭:线性 - 音頻放大器
- 系列:-
- 类型:AB 类
- 输出类型:1-通道(单声道)
- 在某负载时最大输出功率 x 通道数量:700mW x 1 @ 8 欧姆
- 电源电压:2.5 V ~ 5.5 V
- 特点:消除爆音,短路保护和热保护,关闭
- 安装类型:表面贴装
- 供应商设备封装:8-MSOP-PowerPad
- 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
- 包装:®
- 配用:296-10852-ND - EVAL MOD FOR TPA721MSOP
- 其它名称:296-7024-6
产品特性
- Fully Specified for 3.3-V and 5-V Operation
- Wide Power Supply Compatibility 2.5 V 5.5 V
- Output Power for RL = 8 700 mW at VDD = 5 V, BTL 250 mW at VDD = 3.3 V, BTL
- 700 mW at VDD = 5 V, BTL
- 250 mW at VDD = 3.3 V, BTL
- Integrated Depop Circuitry
- Thermal and Short-Circuit Protection
- Surface-Mount Packaging SOIC PowerPAD MSOP
- SOIC
- PowerPAD MSOP
产品概述
The TPA721 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA721 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 µA during shutdown. The TPA721 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.
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