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  • 封装:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.6634-$1.55

更新日期:2024-04-01

产品简介:具有 1.5nA 静态电流的 700mW 单声道、模拟输入 AB 类音频放大器

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  • 封装:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.6634-$1.55

TPA701DGNR 供应商

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  • 封装/批号
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TPA701DGNR 中文资料属性参数

  • 标准包装:1
  • 类别:集成电路 (IC)
  • 家庭:线性 - 音頻放大器
  • 系列:-
  • 类型:AB 类
  • 输出类型:1-通道(单声道)
  • 在某负载时最大输出功率 x 通道数量:700mW x 1 @ 8 欧姆
  • 电源电压:2.5 V ~ 5.5 V
  • 特点:短路和热保护,关闭
  • 安装类型:表面贴装
  • 供应商设备封装:8-MSOP-PowerPad
  • 封装/外壳:8-TSSOP,8-MSOP(0.118",3.00mm 宽)裸露焊盘
  • 包装:®
  • 其它名称:296-7022-6

产品特性

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power for RL = 8 700 mW at VDD = 5 V, BTL 250 mW at VDD = 3.3 V, BTL
  • 700 mW at VDD = 5 V, BTL
  • 250 mW at VDD = 3.3 V, BTL
  • Ultralow Quiescent Current in Shutdown Mode . . . 1.5 nA
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging SOIC PowerPAD™ MSOP
  • SOIC
  • PowerPAD™ MSOP

产品概述

The TPA701 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA701 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown. The TPA701 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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