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  • 封装:8-SOIC(0.154",3.90mm 宽)
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.44175-$1.03

更新日期:2024-04-01 00:04:00

产品简介:支持从桥接式负载切换至单端开关模式的 350mW、单声道 AB 类音频放大器

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  • 封装:8-SOIC(0.154",3.90mm 宽)
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:Digi-Reel®
  • 参考价格:$0.44175-$1.03

TPA311DR 供应商

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TPA311DR 中文资料属性参数

  • 标准包装:1
  • 类别:集成电路 (IC)
  • 家庭:线性 - 音頻放大器
  • 系列:-
  • 类型:AB 类
  • 输出类型:1-通道(单声道)
  • 在某负载时最大输出功率 x 通道数量:700mW x 1 @ 8 欧姆
  • 电源电压:2.5 V ~ 5.5 V
  • 特点:消除爆音,短路保护和热保护,关闭
  • 安装类型:表面贴装
  • 供应商设备封装:8-SOIC
  • 封装/外壳:8-SOIC(0.154",3.90mm 宽)
  • 包装:®
  • 配用:296-10836-ND - EVAL MOD FOR TPA311
  • 其它名称:296-1947-6

产品特性

  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V - 5.5 V
  • Output Power for RL = 8 350 mW at VDD = 5 V, BTL 250 mW at VDD = 5 V, SE 250 mW at VDD = 3.3 V, BTL 75 mW at VDD = 3.3 V, SE
  • 350 mW at VDD = 5 V, BTL
  • 250 mW at VDD = 5 V, SE
  • 250 mW at VDD = 3.3 V, BTL
  • 75 mW at VDD = 3.3 V, SE
  • Shutdown Control IDD = 7 µA at 3.3 V IDD = 60 µA at 5 V
  • IDD = 7 µA at 3.3 V
  • IDD = 60 µA at 5 V
  • BTL to SE Mode Control
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface Mount Packaging SOIC PowerPADTM MSOP
  • SOIC
  • PowerPADTM MSOP

产品概述

The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier developed especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%.

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