- 封装:7-LSSOP(0.11"?,2.80mm 宽)
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:带卷 (TR)
- 参考价格:$0.4125
更新日期:2024-04-01 00:04:00
产品简介:具有三态输出的超级可配置多功能门
查看详情- 封装:7-LSSOP(0.11"?,2.80mm 宽)
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:带卷 (TR)
- 参考价格:$0.4125
SN74LVC1G99DCTT 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI(德州仪器)
-
SM-8
2022+ -
12000
-
上海市
-
-
-
原装可开发票
SN74LVC1G99DCTT 中文资料属性参数
- 标准包装:250
- 类别:集成电路 (IC)
- 家庭:逻辑 - 栅极和逆变器 - 多功能,可配置
- 系列:74LVC
- 逻辑类型:可配置多功能
- 电路数:1
- 输入数:4
- 施密特触发器输入:是
- 输出类型:三态
- 输出电流高,低:32mA,32mA
- 电源电压:1.65 V ~ 5.5 V
- 工作温度:-40°C ~ 85°C
- 安装类型:表面贴装
- 封装/外壳:7-LSSOP(0.11"?,2.80mm 宽)
- 供应商设备封装:SM8
- 包装:带卷 (TR)
产品特性
- Available in Texas Instruments NanoFree Package
- Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Supports Down Translation to VCC
- Max tpd of 6.7 ns at 3.3 V
- Low Power Consumption, 10-µA Max ICC
- ±24-mA Output Drive at 3.3 V
- Offers Nine Different Logic Functions in a Single Package
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Input Hysteresis Allows for Slow Input Transition Time and Better Noise Immunity at Input
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Protection Exceeds JESD 22 2000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
产品概述
The SN74LVC1G99 device is operational from 1.65 V to 5.5 V.The SN74LVC1G99 device features configurable multiple functions with a 3-state output.
The output is disabled when the output-enable (OE) input is high. When
OE is low, the output state is determined by 16 patterns of 4-bit input. The
user can choose logic functions, such as MUX, AND, OR, NAND, NOR, XOR, XNOR, inverter, and buffer.
All inputs can be connected to VCC or GND.This device functions as an independent inverter, but because of Schmitt action, it has
different input threshold levels for positive-going (VT+) and negative-going
(VT–) signals.To ensure the high-impedance state during power up or power down,
OE should be tied to VCC through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the
driver.This device is fully specified for partial-power-down applications using
Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down. NanoFree™ package technologies are a major breakthrough in IC packaging concepts, using
the die as the package.
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