SHT20

www.sensirion.com Version 4 – May 2014 1/14 Datasheet SHT20 Humidity and Temperature Sensor IC ? Fully calibrated ? Digital output, I 2 C interface ? Low power consumption ? Excellent long term stability ? DFN type package – reflow solderable Dimensions Figure 1: Drawing of SHT20 sensor package, dimensions are given in mm (1mm = 0.039inch), tolerances are ±0.1mm. The die pad (center pad) is internally connected to VSS. The NC pads must be left floating. VSS = GND, SDA = DATA. Numbering of E/O pads starts at lower right corner (indicated by notch in die pad) and goes clockwise (compare Table 2). Sensor Chip SHT20 features a generation 4C CMOSens? chip. Besides the capacitive relative humidity sensor and the band gap temperature sensor, the chip contains an amplifier, A/D converter, OTP memory and a digital processing unit. Material Contents While the sensor itself is made of Silicon the sensors’ housing consists of a plated Cu lead-frame and gree

www.sensirion.com Version 4 – May 2014 1/14 Datasheet SHT20 Humidity and Temperature Sensor IC ? Fully calibrated ? Digital output, I 2 C interface ? Low power consumption ? Excellent long term stability ? DFN type package – reflow solderable Dimensions Figure 1: Drawing of SHT20 sensor package, dimensions are given in mm (1mm = 0.039inch), tolerances are ±0.1mm. The die pad (center pad) is internally connected to VSS. The NC pads must be left floating. VSS = GND, SDA = DATA. Numbering of E/O pads starts at lower right corner (indicated by notch in die pad) and goes clockwise (compare Table 2). Sensor Chip SHT20 features a generation 4C CMOSens? chip. Besides the capacitive relative humidity sensor and the band gap temperature sensor, the chip contains an amplifier, A/D converter, OTP memory and a digital processing unit. Material Contents While the sensor itself is made of Silicon the sensors’ housing consists of a plated Cu lead-frame and gree

www.sensirion.com Version 4 – May 2014 1/14 Datasheet SHT20 Humidity and Temperature Sensor IC ? Fully calibrated ? Digital output, I 2 C interface ? Low power consumption ? Excellent long term stability ? DFN type package – reflow solderable Dimensions Figure 1: Drawing of SHT20 sensor package, dimensions are given in mm (1mm = 0.039inch), tolerances are ±0.1mm. The die pad (center pad) is internally connected to VSS. The NC pads must be left floating. VSS = GND, SDA = DATA. Numbering of E/O pads starts at lower right corner (indicated by notch in die pad) and goes clockwise (compare Table 2). Sensor Chip SHT20 features a generation 4C CMOSens? chip. Besides the capacitive relative humidity sensor and the band gap temperature sensor, the chip contains an amplifier, A/D converter, OTP memory and a digital processing unit. Material Contents While the sensor itself is made of Silicon the sensors’ housing consists of a plated Cu lead-frame and gree