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热器件热门型号
| 器件图 | 型号 | 制造商 | 封装 | 描述 | 价格 | |
|---|---|---|---|---|---|---|
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S606P-50 | - |
SILICONE THERMAL GREASE 50G JAR |
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S606P-500 | - |
HIGH PERFORMANCE SILICONE GREASE |
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TG-A1660-40-40-1.5 | - |
THERM PAD 40X40MM GRAY |
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TG-A373F-300-300-0.25-1A | - |
THERM PAD 300MMX300MM W/ADH YLW |
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TG-A486G-300-300-0.3-0 | - |
THERM PAD 300MMX300MM GRAY |
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TG-AH486-35-10-7.0-0 | - |
THERM PAD 35X10MM GRAY |
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TG-DPDSG-30 (20 PACK) | - |
PLUNGERS DISPOS 30CC EFD SYRINGE |
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V2016B | - |
HEATSINK CPU XCUT |
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V2019B | - |
HEATSINK CPU XCUT |
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V2023B | - |
HEATSINK CPU XCUT |
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V2026B | - |
HEATSINK CPU XCUT |
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V2027B | - |
HEATSINK CPU XCUT |
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ZKB271-093-11-UPN | - |
ZIF CIRCUIT BOARD RETAINER |
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125521 | - |
9.75WX36" EXTRUSION 16473 XX5384 |
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5586 210 MM X 300 MM X 1.0 MM | - |
THERM PAD 300MMX210MM GRAY |
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A17634-02 | - |
THERM PAD 228.6MMX228.6MM PINK |
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A17634-08 | - |
THERM PAD 228.6MMX228.6MM PINK |
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ATS-50350P-C1-R0 | - |
HEAT SINK 35MM X 35MM X 17.5MM |
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FHE35-35-26/T710/T | - |
FAN AXIAL 34.6X26.6MM 5VDC 2510 |
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HSB24-252510 | - |
HEAT SINK, BGA,25 X 25 X 10 MM |