手机端
手机版
官方公众号
官方抖音号
您好,欢迎来到知芯网

热器件热门型号

器件图 型号 制造商 封装 描述 价格 PDF
V2027B V2027B -

HEATSINK CPU XCUT

ZKB271-093-11-UPN ZKB271-093-11-UPN -

ZIF CIRCUIT BOARD RETAINER

120-1280 120-1280 -

THERMAL JOINT COMPOUND 80LB 5GAL

125481 125481 -

HEATSINK 12X19" EXTRUSION

125521 125521 -

9.75WX36" EXTRUSION 16473 XX5384

65-1P-GEL30-2500 65-1P-GEL30-2500 -

THERM-A-GAP GEL 30 3.5 W/M-K DIS

8329TCS-200ML 8329TCS-200ML -

EPOXY

A17634-02 A17634-02 -

THERM PAD 228.6MMX228.6MM PINK

A17634-08 A17634-08 -

THERM PAD 228.6MMX228.6MM PINK

ATS-1106-C1-R0 ATS-1106-C1-R0 -

1/2 BRICK HEATSINK 61X58X22.9MM

ATS-1149-C1-R0 ATS-1149-C1-R0 -

FULL BRICK HEATSINK 61X118X11.4M

ATS-50350P-C1-R0 ATS-50350P-C1-R0 -

HEAT SINK 35MM X 35MM X 17.5MM

ATS-60003-C1-R0 ATS-60003-C1-R0 -

HEAT SINK 61MM X 58.2MM X 7MM

ATS-X50270G-C1-R0 ATS-X50270G-C1-R0 -

SUPERGRIP HEATSINK 27X27X12.5MM

FHE35-35-26/T710/T FHE35-35-26/T710/T -

FAN AXIAL 34.6X26.6MM 5VDC 2510

HSB04-171706 HSB04-171706 -

HEAT SINK, BGA, 17 X 17 X 6 MM

HSB24-252510 HSB24-252510 -

HEAT SINK, BGA,25 X 25 X 10 MM

V2023B V2023B -

HEATSINK CPU XCUT

V2026B V2026B -

HEATSINK CPU XCUT

5586 210 MM X 300 MM X 1.0 MM 5586 210 MM X 300 MM X 1.0 MM -

THERM PAD 300MMX210MM GRAY