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  • RoHS:
    • 镉(Cd)/镉化合物 0.01%
    • 六价隔(Cr6+)/六价隔化合物 0.10%
    • 铅(Pb)/铅化合物 0.10%
    • 汞(Hg)/汞化合物 0.10%
    • 多溴联苯(PBB)0.10%
    • 多溴联苯醚(PBDE)0.10% - 含十溴二苯醚(Deca-BDE) 0.10%
    说明:Universal Bus Functions Mil Enh 8B Uni Bus & Two 1B Bus Xcvrs
  • 参考价格:¥22.84-¥23.87

更新日期:2024-04-01 00:04:00

产品简介:增强型产品,8 位通用总线收发器和 2 个 1 位总线收发器

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  • RoHS:
    • 镉(Cd)/镉化合物 0.01%
    • 六价隔(Cr6+)/六价隔化合物 0.10%
    • 铅(Pb)/铅化合物 0.10%
    • 汞(Hg)/汞化合物 0.10%
    • 多溴联苯(PBB)0.10%
    • 多溴联苯醚(PBDE)0.10% - 含十溴二苯醚(Deca-BDE) 0.10%
    说明:Universal Bus Functions Mil Enh 8B Uni Bus & Two 1B Bus Xcvrs
  • 参考价格:¥22.84-¥23.87

V62/05606-01YE 中文资料属性参数

  • 制造商:Texas Instruments
  • 产品种类:通用总线函数
  • 逻辑类型:CMOS
  • 逻辑系列:VME
  • 电路数量:1
  • 传播延迟时间:10.5 ns
  • Supply Voltage - Max:3.45 V
  • Supply Voltage - Min:3.15 V
  • 最大工作温度:+ 85 C
  • 最小工作温度:- 40 C
  • 封装 / 箱体:TVSOP
  • 封装:Reel
  • 功能:Universal Bus Transceiver
  • 高电平输出电流:- 48 mA
  • 低电平输出电流:64 mA
  • 安装风格:SMD/SMT
  • 工作电源电压:3.3 V
  • 输出类型:3-State
  • 极性:Non-Inverting
  • 工厂包装数量:2000

产品特性

  • Controlled BaselineOne Assembly/Test Site, One Fabrication Site
  • One Assembly/Test Site, One Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • Member of the Texas Instruments Widebus Family
  • UBT Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Modes
  • OEC Circuitry Improves Signal Integrity and Reduces Electromagnetic Interference (EMI)
  • Compliant With VME64, 2eVME, and 2eSST Protocols Validated at TA = -40°C to 85°C
  • Bus Transceiver Split LVTTL Port Provides a Feedback Path for Control and Diagnostics Monitoring
  • I/O Interfaces are 5-V Tolerant
  • B-Port Outputs (-48 mA/64 mA)
  • Y and A-Port Outputs (-12 mA/12 mA)
  • Ioff, Power-Up 3-State, and BIAS VCC Support Live Insertion
  • Bus Hold on 3A-Port Data Inputs
  • 26-Ω Equivalent Series Resistor on 3A Ports and Y Outputs
  • Flow-Through Architecture Facilitates Printed Circuit Board Layout
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 222000-V Human-Body Model (A114-A) 200-V Machine Model (A115-A) 1000-V Charged-Device Model (C101)
  • 2000-V Human-Body Model (A114-A)
  • 200-V Machine Model (A115-A)
  • 1000-V Charged-Device Model (C101)

产品概述

The SN74VMEH22501A-EP 8-bit universal bus transceiver has two integral 1-bit three-wire bus transceivers and is designed for 3.3-V VCC operation with 5-V tolerant inputs. The UBT transceiver allows transparent, latched, and flip-flop modes of data transfer, and the separate LVTTL input and outputs on the bus transceivers provide a feedback path for control and diagnostics monitoring. This device provides a high-speed interface between cards operating at LVTTL logic levels and VME64, VME64x, or VME320(2) backplane topologies.The SN74VMEH22501A-EP device is pin-for-pin compatible to the SN74VMEH22501 device (SCES357), but operates at a wider operating temperature range.High-speed backplane operation is a direct result of the improved OEC circuitry and high drive that has been designed and tested into the VME64x backplane model. The B-port I/Os are optimized for driving large capacitive loads and include pseudo-ETL input thresholds (½ VCC ±50 mV) for increased noise immunity. These specifications support the 2eVME protocols in VME64x (ANSI/VITA 1.1) and 2eSST protocols in VITA 1.5. With proper design of a 21-slot VME system, a designer can achieve 320-MB transfer rates on linear backplanes and, possibly, 1-GB transfer rates on the VME320 backplane.All inputs and outputs are 5-V tolerant and are compatible with TTL and 5-V CMOS inputs.Active bus-hold circuitry holds unused or undriven 3A-port inputs at a valid logic state. Bus-hold circuitry is not provided on 1A or 2A inputs, any B-port input, or any control input. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended.This device is fully specified for live-insertion applications using Ioff, power-up 3-state, and BIAS VCC. The Ioff circuitry prevents damaging current to backflow through the device when it is powered off/on. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. The BIAS VCC circuitry precharges and preconditions the B-port input/output connections, preventing disturbance of active data on the backplane during card insertion or removal, and permits true live-insertion capability.When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, output-enable (OE and OEBY) inputs should be tied to VCC through a pullup resistor and output-enable (OEAB) inputs should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the drive capability of the device connected to this input.

V62/05606-01YE 电路图

V62/05606-01YE 电路图

V62/05606-01YE 电路图

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