- 参考价格:¥4.71-¥5.31
更新日期:2024-04-01
TPS71825-12DRVR 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
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TI
-
WSON-6
22+ -
6000
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上海市
-
-
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原厂原装上海仓现货
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TI
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VQFN
21+ -
20000
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上海市
-
-
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原装现货,品质为先!请来电垂询!
TPS71825-12DRVR 中文资料属性参数
- 制造商:Texas Instruments
- 产品种类:低压降 (LDO) 调节器
- 最大输入电压:6.5 V
- 输出电压:2.5 V, 1.2 V
- 输出电流:200 mA
- 负载调节:75 uV / mA
- 输出端数量:2
- 输出类型:Fixed
- 最大工作温度:+ 125 C
- 安装风格:SMD/SMT
- 封装 / 箱体:WSON EP
- 输入偏流(最大值):0.09 mA
- Input Voltage MIN:+ 2.7 V
- 线路调整率:130 uV / V
- 最大功率耗散:1.053 W
- 最小工作温度:- 40 C
- 封装:Reel
- 工厂包装数量:3000
- 电压调节准确度:2.5 %
产品特性
- Dual, 200mA High-Performance LDOs
- Low Total Quiescent Current: 90µA with Both LDOs Enabled
- Low Noise: 70µVRMS/V
- Active Output Pulldown (TPS719xx)
- Independent Enables for Each LDO
- PSRR: 65dB at 1kHz, 45dB at 1MHz
- Available in Multiple Fixed-Output Voltage Combinations from 0.9V to 3.6V Using Innovative Factory EEPROM Programming
- Fast Start-Up Time: 160µs
- Over-Current, Over-Temperature and Under-Voltage Protection
- Low Dropout: 230mV at 200mA
- Stable with 1µF Ceramic Output Capacitor
- Available in 2mm × 2mm SON-6 and 6-Ball WCSP Packages
- APPLICATIONS Digital Cameras and Camera ModulesCellular Camera and TV PhonesWireless LAN, BluetoothHandheld Products
- Digital Cameras and Camera Modules
- Cellular Camera and TV Phones
- Wireless LAN, Bluetooth
- Handheld Products
产品概述
The TPS718xx and TPS719xx families of low-dropout (LDO) regulators offer a high power-supply rejection ratio (PSRR), low noise, fast start-up, and excellent line and load transient responses while consuming a very low 90µA (typical) at no load ground current with both LDOs enabled. The TPS719xx also provides an active pulldown circuit to quickly discharge output loads. The TPS718xx and TPS719xx are stable with ceramic capacitors and use an advanced BiCMOS fabrication process to yield a typical dropout voltage of 230mV at 200mA output loads. The TPS718xx and TPS719xx also use a precision voltage reference and feedback loop to achieve 3% overall accuracy over all load, line, process, and temperature variations. Both families of devices are fully specified from TJ = -40°C to +125°C and are offered in 2mm × 2mm SON-6 and 6-ball Wafer Chip-Scale (WCSP) packages that are ideal for applications such as mobile handsets and WLAN that require good thermal dissipation while maintaining a very small footprint.
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