- 封装:14-TSSOP (0.173",4.40mm 宽)裸露焊盘
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:带卷 (TR)
- 参考价格:$3.705
更新日期:2024-04-01
产品简介:250mA 双路差分 DSL 和 PLC 线路驱动器
查看详情- 封装:14-TSSOP (0.173",4.40mm 宽)裸露焊盘
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:带卷 (TR)
- 参考价格:$3.705
THS6022IPWPR 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI
-
HTSSOP14
23+ -
5800
-
上海市
-
-
-
进口原装现货,杜绝假货。
-
TI(德州仪器)
-
HTSSOP-14
2022+ -
12000
-
上海市
-
-
-
原装可开发票
THS6022IPWPR 中文资料属性参数
- 标准包装:2,000
- 类别:集成电路 (IC)
- 家庭:接口 - 驱动器,接收器,收发器
- 系列:-
- 类型:线路驱动器,发射器
- 驱动器/接收器数:2/0
- 规程:DSL
- 电源电压:5 V ~ 15 V
- 安装类型:表面贴装
- 封装/外壳:14-TSSOP (0.173",4.40mm 宽)裸露焊盘
- 供应商设备封装:14-HTSSOP
- 包装:带卷 (TR)
- 配用:296-10063-ND - EVAL MOD FOR THS6022
产品特性
- ADSL, HDSL and VDSL Differential Line Driver
- 200-mA Output Current Minimum Into 50- Load
- High Speed210-MHz Bandwidth (-3-dB) at 50- Load1900-V/µs Slew Rate, G = 5
- 210-MHz Bandwidth (-3-dB) at 50- Load
- 1900-V/µs Slew Rate, G = 5
- Low Distortion-69-dB Third-Order Harmonic Distortion at f = 1 MHz, 50- Load, and VO(PP) = 20 V
- -69-dB Third-Order Harmonic Distortion at f = 1 MHz, 50- Load, and VO(PP) = 20 V
- Independent Power Supplies for Low Crosstalk
- Wide Supply Range ±5 V to ±15 V
- Thermal-Shutdown and Short-Circuit Protection
- Evaluation Module Available
产品概述
The THS6022 contains two high-speed drivers capable of providing 200-mA output current (minimum) into a 50- load. These drivers can be configured differentially to drive a 50-V p-p output signal over low-impedance lines. The drivers are current feedback amplifiers, designed for the high slew rates necessary to support low total harmonic distortion (THD) in xDSL applications. The THS6022 is ideally suited for asymmetrical digital subscriber line (ADSL) at the remote terminal, high-data-rate digital subscriber line (HDSL), and very high-data-rate digital subscribe line (VDSL), where it supports the high-peak voltage and current requirements of these applications. Separate power supply connections for each driver are provided to minimize crosstalk.The THS6022 is packaged in the patented PowerPAD™ package. This package provides outstanding thermal characteristics in a small-footprint package that is fully compatible with automated surface-mount assembly procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the junction.
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