- 封装:8-XFBGA,DSBGA
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.2475-$0.62
更新日期:2024-04-01 00:04:00
产品简介:具有施密特触发输入的 3 通道、0.8V 至 3.6V 低功耗反相器
查看详情- 封装:8-XFBGA,DSBGA
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.2475-$0.62
SN74AUP3G14YFPR 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI(德州仪器)
-
DSBGA-8
2022+ -
12000
-
上海市
-
-
-
原装可开发票
SN74AUP3G14YFPR 中文资料属性参数
- 标准包装:1
- 类别:集成电路 (IC)
- 家庭:逻辑 - 栅极和逆变器
- 系列:74AUP
- 逻辑类型:逆变器,缓冲器
- 电路数:3
- 输入数:1
- 特点:施密特触发器
- 电源电压:0.8 V ~ 3.6 V
- 电流 - 静态(最大值):0.5µA
- 输出电流高,低:4mA,4mA
- 逻辑电平 - 低:0.1 V ~ 0.88 V
- 逻辑电平 - 高:0.6 V ~ 2.29 V
- 额定电压和最大 CL 时的最大传播延迟:6.2ns @ 3V ~ 3.6V,30pF
- 工作温度:-40°C ~ 85°C
- 安装类型:表面贴装
- 供应商设备封装:8-DSBGA(1.6x0.8)
- 封装/外壳:8-XFBGA,DSBGA
- 包装:®
- 其它名称:296-25211-6
产品特性
- Available in the Texas Instruments NanoStar Package
- Low Static-Power Consumption (ICC = 0.9 µA Maximum)
- Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.3 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22 2000-V Human-Body Model (A114-B, Class II) 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
产品概述
The AUP family is TI's premier solution to the industry's low-power needs in
battery-powered portable applications. This family ensures a very low static- and dynamic-power
consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in
increased battery life. This product also maintains excellent signal integrity.The SN74AUP3G14 contains three inverters and performs the Boolean function Y =
A. The device functions as three independent inverters but, because of Schmitt action, it may have different input threshold levels for positive-going
(VT+) and negative-going (VT–) signals.NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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