- 封装:8-UFQFN
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.176-$0.54
更新日期:2024-04-01 00:04:00
产品简介:双通道、双输入、0.8V 至 3.6V 低功耗 (< 1uA) 或门
查看详情- 封装:8-UFQFN
- RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
- 包装方式:Digi-Reel®
- 参考价格:$0.176-$0.54
SN74AUP2G32RSER 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
-
TI
-
原厂原装
22+ -
3288
-
上海市
-
-
-
一级代理原装
-
TI(德州仪器)
-
UQFN-8
2022+ -
988
-
上海市
-
-
-
原装可开发票
SN74AUP2G32RSER 中文资料属性参数
- 标准包装:1
- 类别:集成电路 (IC)
- 家庭:逻辑 - 栅极和逆变器
- 系列:74AUP
- 逻辑类型:或门
- 电路数:2
- 输入数:2
- 特点:-
- 电源电压:0.8 V ~ 3.6 V
- 电流 - 静态(最大值):0.5µA
- 输出电流高,低:4mA,4mA
- 逻辑电平 - 低:0.7 V ~ 0.9 V
- 逻辑电平 - 高:1.6 V ~ 2 V
- 额定电压和最大 CL 时的最大传播延迟:6.2ns @ 3V ~ 3.6V,30pF
- 工作温度:-40°C ~ 85°C
- 安装类型:表面贴装
- 供应商设备封装:8-UQFN(1.5x1.5)
- 封装/外壳:8-UFQFN
- 包装:®
- 其它名称:296-27369-6
产品特性
- Available in the Texas Instruments NanoStar™ Package
- Low Static-Power Consumption (ICC = 0.9 µA Maximum)
- Low Dynamic-Power Consumption (Cpd = 4.3 pF Typ at 3.3 V)
- Low Input Capacitance (Ci = 1.5 pF Typical)
- Low Noise – Overshoot and Undershoot <10% of VCC
- Ioff Supports Partial-Power-Down Mode Operation
- Wide Operating VCC Range of 0.8 V to 3.6 V
- Optimized for 3.3-V Operation
- 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
- tpd = 4.3 ns Maximum at 3.3 V
- Suitable for Point-to-Point Applications
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22 2000-V Human-Body Model (A114-B, Class II) 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
产品概述
The AUP family is TIs premier solution to the industrys low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCC range of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).The SN74AUP2G32 performs the Boolean function Y = A + B or Y = A\ • B\ in positive logic.NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.
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