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SMD291SNL
焊接、脱焊、返修产品- 参考价格：$14.8500
更新日期：2024-04-01 00:04:00
SMD291SNL 中文资料属性参数
- 特色产品：Solder Paste and Flux
- 标准包装：1
- 类别：焊接、脱焊、返修产品
- 家庭：焊接
- 系列：CHIPQUIK®
- 制程：无铅
- 类型：焊膏
- 焊剂类型：免清洁
- 复合体：Sn96.5Ag3.0Cu0.5 (96.5/3/0.5)
- 线规：-
- 直径：-
- 芯体尺寸：-
- 形态：注射器，15g (0.5 oz)
- 融点：421°F (216°C)
- 装运信息：Ships with Cold Pack
- 工具箱：SMD6000-ND - SOLDER/DESOLDER REWORK KIT SMD
- 其它名称：SMD 291SNL
SMD291SNL 数据手册
| 数据手册 | 说明 | 数量 | 操作 |
|---|---|---|---|
 SMD291SNL
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Syringe, 15g (0.5 oz) |
2页,138K | 查看 |
|
SMD291SNL10
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Syringe, 10cc, 35g (1.2 oz) |
2页,138K | 查看 |
|
SMD291SNL10T4
|
SLDR PST NO-CLEAN SAC305 T4 10CC |
2页,138K | 查看 |
|
SMD291SNL10T5
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Syringe, 10cc, 35g (1.2 oz) |
2页,138K | 查看 |
|
SMD291SNL15T4
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 15g (0.5 oz) |
2页,140K | 查看 |
|
SMD291SNL250T3
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 250g (9 oz) |
2页,138K | 查看 |
|
SMD291SNL250T4
|
SLDR PST NO-CLEAN SAC305 T4 250G |
2页,139K | 查看 |
|
SMD291SNL250T5
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 250g (9 oz) |
2页,138K | 查看 |
|
SMD291SNL500T3C
|
SOLDER PASTE NO-CLEAN SAC305 T3 |
2页,139K | 查看 |
|
SMD291SNL50T3
|
Lead Free No-Clean Solder Paste Sn96.5Ag3.0Cu0.5 (96.5/3/0.5) Jar, 50g (1.8oz) |
2页,138K | 查看 |