您好,欢迎来到知芯网
  • 参考价格:¥262.75-¥307.74

更新日期:2024-04-01

产品简介:具有 150MHz 频率、256KB 闪存、EMIF 的 C2000? 32 位 MCU(增强型产品)

查看详情
  • 参考价格:¥262.75-¥307.74

SM320F2812PGFMEP 供应商

  • 公司
  • 型号
  • 品牌
  • 封装/批号
  • 数量
  • 地区
  • 日期
  • 说明
  • 询价

SM320F2812PGFMEP 中文资料属性参数

  • 制造商:Texas Instruments
  • 产品种类:数字信号处理器与控制器 (DSP, DSC)
  • 数据总线宽度:32 bit
  • 程序存储器大小:1 K
  • 数据 RAM 大小:36 KB
  • 最大时钟频率:150 MHz
  • 可编程输入/输出端数量:56
  • 工作电源电压:1.9 V
  • 最大工作温度:+ 125 C
  • 封装 / 箱体:LQFP-176
  • 安装风格:SMD/SMT
  • 最小工作温度:- 55 C
  • 封装:Tray
  • 产品:DSPs
  • 程序存储器类型:OTP ROM
  • 工厂包装数量:40

产品特性

  • Controlled Baseline One Assembly/Test/Fabrication Site
  • One Assembly/Test/Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Static CMOS Technology 150 MHz (6.67-ns Cycle Time) Low-Power (1.8-V Core @135 MHz, 1.9-V Core @150 MHz, 3.3-V I/O) Design
  • 150 MHz (6.67-ns Cycle Time)
  • Low-Power (1.8-V Core @135 MHz, 1.9-V Core @150 MHz, 3.3-V I/O) Design
  • JTAG Boundary Scan Support(2)
  • High-Performance 32-Bit CPU (320C28x) 16 × 16 and 32 × 32 MAC Operations 16 × 16 Dual MAC Harvard Bus Architecture Atomic Operations Fast Interrupt Response and Processing Unified Memory Programming Model 4M Linear Program/Data Address Reach Code-Efficient (in C/C++ and Assembly) 320F24x/LF240x Processor Source Code Compatible
  • 16 × 16 and 32 × 32 MAC Operations
  • 16 × 16 Dual MAC
  • Harvard Bus Architecture
  • Atomic Operations
  • Fast Interrupt Response and Processing
  • Unified Memory Programming Model
  • 4M Linear Program/Data Address Reach
  • Code-Efficient (in C/C++ and Assembly)
  • 320F24x/LF240x Processor Source Code Compatible
  • On-Chip Memory Flash Devices: Up to 128K × 16 Flash (Four 8K × 16 and Six 16K × 16 Sectors) ROM Devices: Up to 128K × 16 ROM 1K × 16 OTP ROM L0 and L1: 2 Blocks of 4K × 16 Each Single-Access RAM (SARAM) H0: 1 Block of 8K × 16 SARAM M0 and M1: 2 Blocks of 1K × 16 Each SARAM
  • Flash Devices: Up to 128K × 16 Flash (Four 8K × 16 and Six 16K × 16 Sectors)
  • ROM Devices: Up to 128K × 16 ROM
  • 1K × 16 OTP ROM
  • L0 and L1: 2 Blocks of 4K × 16 Each Single-Access RAM (SARAM)
  • H0: 1 Block of 8K × 16 SARAM
  • M0 and M1: 2 Blocks of 1K × 16 Each SARAM
  • Boot ROM (4K × 16) With Software Boot Modes Standard Math Tables
  • With Software Boot Modes
  • Standard Math Tables
  • External Interface (2812) Over 1M × 16 Total Memory Programmable Wait States Programmable Read/Write Strobe Timing Three Individual Chip Selects
  • Over 1M × 16 Total Memory
  • Programmable Wait States
  • Programmable Read/Write Strobe Timing
  • Three Individual Chip Selects
  • Clock and System Control Dynamic PLL Ratio Changes Supported On-Chip Oscillator Watchdog Timer Module
  • Dynamic PLL Ratio Changes Supported
  • On-Chip Oscillator
  • Watchdog Timer Module
  • Three External Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports 45 Peripheral Interrupts
  • Three 32-Bit CPU-Timers
  • 128-Bit Security Key/Lock Protects Flash/ROM/OTP and L0/L1 SARAM Prevents Firmware Reverse Engineering
  • Protects Flash/ROM/OTP and L0/L1 SARAM
  • Prevents Firmware Reverse Engineering
  • Motor Control Peripherals Two Event Managers (EVA, EVB) Compatible to 240xA Devices
  • Two Event Managers (EVA, EVB)
  • Compatible to 240xA Devices
  • Serial Port Peripherals Serial Peripheral Interface (SPI) Two Serial Communications Interfaces (SCIs), Standard UART Enhanced Controller Area Network (eCAN) Multichannel Buffered Serial Port (McBSP)
  • Serial Peripheral Interface (SPI)
  • Two Serial Communications Interfaces (SCIs), Standard UART
  • Enhanced Controller Area Network (eCAN)
  • Multichannel Buffered Serial Port (McBSP)
  • 12-Bit ADC, 16 Channels 2 × 8 Channel Input Multiplexer Two Sample-and-Hold Single/Simultaneous Conversions Fast Conversion Rate: 80 ns/12.5 MSPS
  • 2 × 8 Channel Input Multiplexer
  • Two Sample-and-Hold
  • Single/Simultaneous Conversions
  • Fast Conversion Rate: 80 ns/12.5 MSPS
  • Up to 56 General Purpose I/O (GPIO) Pins
  • Advanced Emulation Features Analysis and Breakpoint Functions Real-Time Debug via Hardware
  • Analysis and Breakpoint Functions
  • Real-Time Debug via Hardware
  • Development Tools Include ANSI C/C++ Compiler/Assembler/Linker Code Composer Studio™ IDE DSP/BIOS™
  • ANSI C/C++ Compiler/Assembler/Linker
  • Code Composer Studio™ IDE
  • DSP/BIOS™
  • Low-Power Modes and Power Savings IDLE, STANDBY, HALT Modes Supported Disable Individual Peripheral Clocks
  • IDLE, STANDBY, HALT Modes Supported
  • Disable Individual Peripheral Clocks
  • Package Options 179-Ball MicroStar BGA™ (GHH), (2812) 176-Pin Low-Profile Quad Flatpack (LQFP) (PGF) (2812)
  • 179-Ball MicroStar BGA™ (GHH), (2812)
  • 176-Pin Low-Profile Quad Flatpack (LQFP) (PGF) (2812)

产品概述

The SM320F2810-EP, SM320F2811-EP, SM320F2812-EP, SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The functional blocks and the memory maps are described in Section 3, Functional Overview.Throughout this document, SM320F2810-EP, SM320F2811-EP, and SM320F2812-EP are abbreviated as F2810, F2811, and F2812, respectively. F281x denotes all three Flash devices. SM320C2810-EP, SM320C2811-EP, and SM320C2812-EP are abbreviated as C2810, C2811, and C2812, respectively. C281x denotes all three ROM devices. 2810 denotes both F2810 and C2810 devices; 2811 denotes both F2811 and C2811 devices; and 2812 denotes both F2812 and C2812 devices.

SM320F2812PGFMEP 数据手册

数据手册 说明 数量 操作
SM320F2812PGFMEP

Digital Signal Processors

159 Pages页,2.04M 查看

IC 索引: A B C D E F G H I J K L M N O P Q R S T U V W X Y Z 0 1 2 3 4 5 6 7 8 9