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LMV1032UR-25/NOPB

Texas Instruments 音频 IC
  • 参考价格:¥10.35-¥9.32

更新日期:2024-04-01 00:04:00

LMV1032UR-25/NOPB

Texas Instruments 音频 IC

产品简介:用于 3 线驻极体麦克风的模拟输入麦克风前置放大器

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  • 参考价格:¥10.35-¥9.32

LMV1032UR-25/NOPB 供应商

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  • 封装/批号
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LMV1032UR-25/NOPB 中文资料属性参数

  • 制造商:National Semiconductor (TI)
  • 产品:Class-AB
  • 输出类型:1-Channel Mono
  • 可用增益调整:25.5 dB
  • THD + 噪声:0.35 %
  • 工作电源电压:3 V
  • 电源电流:0.06 mA at 5 V
  • 最大工作温度:+ 85 C
  • 安装风格:SMD/SMT
  • 封装 / 箱体:uSMD
  • 封装:Reel
  • 输入信号类型:Single
  • 最小工作温度:- 40 C
  • 输出信号类型:Single
  • 工厂包装数量:250
  • 电源类型:Single
  • Supply Voltage - Max:5 V
  • Supply Voltage - Min:1.7 V

产品特性

  • (Typical LMV1032-15, 1.7V Supply; Unless Otherwise Noted)
  • Output Voltage Noise (A-weighted) −89 dBV
  • Low Supply Current 60 μA
  • Supply Voltage 1.7V to 5V
  • PSRR 70 dB
  • Signal to Noise Ratio 61 dB
  • Input Capacitance 2 pF
  • Input Impedance >100 MΩ
  • Output Impedance <200Ω
  • Max Input Signal 170 mVPP
  • Temperature Range −40°C to 85°C
  • Large Dome 4-Bump DSBGA Package with Improved Adhesion Technology.

产品概述

The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature.The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria.

LMV1032UR-25/NOPB 数据手册

数据手册 说明 数量 操作
LMV1032UR-25/NOPB

Amplifier IC 1-Channel (Mono) Class AB 4-DSBGA

20页,1016K 查看

LMV1032UR-25/NOPB 电路图

LMV1032UR-25/NOPB 电路图

LMV1032UR-25/NOPB 电路图

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