更新日期:2024-04-01
产品简介:CMOS 18 级静态移位寄存器
查看详情CD4006BF3A 供应商
- 公司
- 型号
- 品牌
- 封装/批号
- 数量
- 地区
- 日期
- 说明
- 询价
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DIP
2019+ -
5800
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上海市
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-
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全新原装现货
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TI
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标准封装
23+ -
15000
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上海市
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中国区代理原装进口特价
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TI
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DIP
23+ -
5800
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上海市
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-
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进口原装现货,杜绝假货。
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TI
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DIP
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1
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台州
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CD4006BF3A 中文资料属性参数
- 现有数量:0现货4,749Factory
- 价格:在售
- 系列:*
- 包装:管件
- 产品状态:在售
- 逻辑类型:-
- 输出类型:-
- 元件数:-
- 每个元件位数:-
- 功能:-
- 电压 - 供电:-
- 工作温度:-
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- 封装/外壳:-
- 供应商器件封装:-
产品特性
- Fully static operation
- Shifting rates up to 12 MHz @ 10 V (typ.)
- Permanent register storage with clock line high or low - no information recirculation required
- 100% tested for quiescent current at 20 V
- Standardized, symmetrical output characteristics
- 5-V, 10-V, and 15-V parametric ratings
- Maximum input current of 1 uA at 18 V over full package-temperature range; 100 nA at 18 V and 25°C
- Noise margin (full package-temperature range) = 1 V at VDD = 5 V 2 V at VDD = 10 V 2.5 V at VDD = 15 V
- Meets all requirements of JEDEC Tentative Standard No. 13B, "Standard Specifications for Description of 'B' series CMOS Devices"
- Applications Serial shift registers Frequency division Time delay circuits
- Serial shift registers
- Frequency division
- Time delay circuits
产品概述
CD4006B types are composed of 4 separate shift register sections: two sections of four stages and two sections of five stages with an output tap at the fourth stage. Each section has an independent single-rail data path.
A common clock signal is used for all stages. Data are shifted to the next stage on negative-going transitions of the clock. Through appropriate connections of inputs and outputs, multiple register sections of 4, 5, 8, and 9 stages or single register sections of 10, 12, 13, 14, 16, 17 and 18 stages can be implemented using one CD4006B package. Longer shift register sections can be assembled by using more than one CD4006B.
To facilitate cascading stages when clock rise and fall times are slow, an optional output (D1+4') that is delayed one-half clock-cycle, is provided (see Truth Table for Output from Term. 2).
The CD4006B types are supplied in 14-lead hermetic dual-in-line ceramic packages (D and F suffixes), 14-lead dual-in-line plastic packages (E suffix), and in chip form (H suffix).
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