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热器件热门型号
| 器件图 | 型号 | 制造商 | 封装 | 描述 | 价格 | |
|---|---|---|---|---|---|---|
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5590H-TO3 | - |
THERM PAD 41.91X28.96MM GRAY |
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60-12-8302-1671 | - |
THERM PAD 18.03MMX12.7MM W/ADH |
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8327GF25-50CC | - |
THERMAL GAP FILL LIQUID SILICONE |
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8327GF41-50CC | - |
THERMAL GAP FILL LIQUID SILICONE |
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9340006-304 | - |
PELTIER MS5,257,10,15,00,W8 |
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9350003-399 | - |
MS2,192,14,20,15,25,TA,RT,W12 |
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9350006-307 | - |
MS2,192,14,20,11,18,22,W8 |
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ATS-PCB1035 | - |
HEATSINK TO-220 W/TAB BLACK |
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ATS-PCB1047 | - |
HEATSINK TO-218/TO-247 W/TAB |
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ATS-PCB1050 | - |
HEATSINK TO-220 W/TAB BLACK |
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ATS-PCB1068 | - |
HEATSINK TO-220 W/TAB BLACK |
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ATS-TEC10-47-012 | - |
TEC MODULE, 10X10X4.7 |
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ATS-TEC30-33-020 | - |
TEC MODULE, 30X30X3.3 |
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DV-T263-201E-TR | - |
HEATSINK FOR TO-263 |
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DV-T268-301E-TR | - |
HEATSINK FOR TO-268 |
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E2A-T220-25E | - |
BLACK ANODIZED HEATSINK |
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E2A-T220-38E | - |
BLACK ANODIZED HEATSINK |
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HSE-B250-04H | - |
HEAT SINK, EXTRUSION, TO-220, 25 |
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HSS02-B20-P318 | - |
HEAT SINK, STAMPING, TO-220, 23. |
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2641198 | - |
BERGQUIST LIQUIFORM TLF 6000HG 1 |