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热 - 垫，片热门型号
| 器件图 | 型号 | 制造商 | 封装 | 描述 | 价格 | |
|---|---|---|---|---|---|---|
| A16365-19 | - |
TFLEX XS4190 9" X 9" |
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| A16365-20 | - |
TFLEX XS4200 9" X 9" |
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| A16366-02 | - |
TFLEX SF620 DF 17" X 18" |
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| A16366-03 | - |
TFLEX SF630 DF 17" X 18" |
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| A16366-04 | - |
TFLEX SF640 DF 17" X 18" |
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| A16366-05 | - |
TFLEX SF650 DF 17" X 18" |
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| A16366-06 | - |
TFLEX SF660 DF 17" X 18" |
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| A16366-23 | - |
TFLEX SF623 DF 17" X 18" |
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 |
A16367-02 | - |
TFLEX SF620DF 8.5X9" |
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| A16367-03 | - |
TFLEX SF630 DF 8.5" X 9.0" |
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 |
A16367-04 | - |
TFLEX SF640 DF 8.5" X 9.0" |
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| A16367-05 | - |
TFLEX SF650 DF 8.5" X 9.0" |
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| A16367-23 | - |
TFLEX SF623 DF 8.5" X 9.0" |
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| A16708-02 | - |
TFLEX 320,DC1 9" X 9" |
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| A16708-03 | - |
TFLEX 330,DC1 9" X 9" |
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| A16708-36 | - |
TFLEX 340FG,DC1 9" X 9" |
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| B660B-0.0055-00-1112-NA | Bergquist |
BOND PLY 660B 11X12" |
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CPU .63X.63 | Bergquist |
THERMAL PAD CPU .63"X.63" |
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| Q3-0.005-00-105 | Bergquist |
THERMAL PAD SIP .005" Q3 |
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Q3-0.005-00-114 | Bergquist |
THERMAL PAD TO-220 .005" Q3 |