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  • 封装:32-VFQFN 裸露焊盘
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:管件
  • 参考价格:$10.625-$9.68752

更新日期:2024-04-01 00:04:00

产品简介:1.3V 微功率单通道编解码器

查看详情
  • 封装:32-VFQFN 裸露焊盘
  • RoHS:无铅 / 符合限制有害物质指令(RoHS)规范要求
  • 包装方式:管件
  • 参考价格:$10.625-$9.68752

AIC111RHB 供应商

  • 公司
  • 型号
  • 品牌
  • 封装/批号
  • 数量
  • 地区
  • 日期
  • 说明
  • 询价

AIC111RHB 中文资料属性参数

  • 标准包装:73
  • 类别:集成电路 (IC)
  • 家庭:接口 - 编解码器
  • 系列:microPOWER™
  • 类型:语音频带编解码器
  • 数据接口:串行
  • 分辨率(位):16 b
  • ADC / DAC 数量:1 / 1
  • 三角积分调变:
  • S/N 比,标准 ADC / DAC (db):-
  • 动态范围,标准 ADC / DAC (db):-
  • 电压 - 电源,模拟:1.1 V ~ 1.5 V
  • 电压 - 电源,数字:1.1 V ~ 1.5 V
  • 工作温度:0°C ~ 70°C
  • 安装类型:表面贴装
  • 封装/外壳:32-VFQFN 裸露焊盘
  • 供应商设备封装:32-QFN 裸露焊盘(5x5)
  • 包装:管件
  • 配用:296-18386-ND - EVALUATION MODULE FOR AIC111
  • 其它名称:296-15335

产品特性

  • Single Channel Codec
  • Noise Shaped Delta Sigma ADC and DAC Technology
  • Low Supply Voltage and Current: 1.3-V Typical Power Supply 350-µA Typical Supply Current Drain
  • 1.3-V Typical Power Supply
  • 350-µA Typical Supply Current Drain
  • Power Supply Up Monitor and Low Battery Monitor That Also Automatically Shuts Off H-Bridge Output When Battery Decays Below 1.05 V in a Nontransient Manner
  • Typical 2.4-µVrms Input Referred Noise With 0.01% Total Harmonic Distortion for Front End and 108-dB Dynamic Range
  • ADC Has 87-dB Dynamic Range With 73-dB Total Harmonic Distortion 100 Hz–10 kHz, 40-kHz Sampling Rate
  • Typical 55-dB PSRR 100 Hz to 10 kHz for Analog Front End
  • Low Noise Programmable Gain Amplifier/Compressor Front End With Programmable Fast and Slow Attack and Decay Rates With Dual or Single Attack and Decay Rate Option
  • Typical Output Noise of 12 µVrms With 0.05% Total Harmonic Distortion for Delta Sigma DAC and H-Bridge Output Driver
  • Low Jitter Oscillator That Generates all Internal Clocks and Generates 5-MHz Output DSP/µC Clock
  • Regulated Bandgap Voltage Reference
  • Programmable Functionality via Digital Serial Interface McBSP Interface, DSP Protocol TI TMS320VC54x™, TMS320VC55x™ DSPs SPI Interface, Microcontroller Protocol TI MSP430xx
  • McBSP Interface, DSP Protocol
  • TI TMS320VC54x™, TMS320VC55x™ DSPs
  • SPI Interface, Microcontroller Protocol
  • TI MSP430xx
  • External Chip Power Down and Reset
  • Available in: 32-Pin QFN 5×5-mm Plastic Package 32-Pad Bumped Die in Waffle Pack (wafer scale packaging)
  • 32-Pin QFN 5×5-mm Plastic Package
  • 32-Pad Bumped Die in Waffle Pack (wafer scale packaging)
  • APPLICATIONS Hearing Instruments Personal Medical Devices Hearing Protection Aural Processing Low-Power Headsets
  • Hearing Instruments
  • Personal Medical Devices
  • Hearing Protection
  • Aural Processing
  • Low-Power Headsets

产品概述

The AIC111 IC design specification serves to provide product development teams with a guideline for how the AIC111 IC is specified and programmable options that are available. The document outlines a top-level block description of the IC along with system specifications and functions. Individual block descriptions and target specifications are also outlined.The Texas Instruments AIC111 is a TI µPower DSP compatible, or microcontroller compatible audio codec product, or analog interface circuit. The AIC111 is part of a comprehensive family of DSP/µC based high-performance analog interface solutions. The AIC111 is targeted primarily at personal medical devices, such as hearing instruments, aural preprocessing applications, and low-power headset applications. The AIC111 is used in any design requiring a programmable time constant PGA/compressor interface, high dynamic range analog-to-digital converter, an external DSP/µC handling signal processing, or a low distortion digital-to-analog converter with a balanced H-Bridge speaker driver. It supports a CMOS digital interface tailored for TI DSPs with the McBSP protocol such as TMS320VC54x™ DSP family and SPI-based controllers such as TI MSP430x family of microcontrollers. The AIC111 also has an external microphone or sensor supply and bias and power supply up low-battery monitor indicator.The AIC111 comes in a 32-pin QFN 5×5-mm package. A 32-pad solder ball bumped flip chip die that comes in waffle packs or tape and reel is in preview and will be available 3rd quarter 2003.

AIC111RHB 数据手册

数据手册 说明 数量 操作
AIC111RHB

IC DESIGN SPECIFICATION 1.3-V microPower DSP/uC VOICE BAND AUDIO CODEC

29 Pages页,231K 查看
AIC111RHB

Voice-Band Interface 16 b Serial 32-VQFN (5x5)

33页,317K 查看
AIC111RHBG4

1.3-V micro Power Single Channel Codec 32-QFN 0 to 70

33页,692K 查看
AIC111RHBR

IC DESIGN SPECIFICATION 1.3-V microPower DSP/uC VOICE BAND AUDIO CODEC

29 Pages页,229K 查看
AIC111RHBRG4

IC DESIGN SPECIFICATION 1.3-V microPower DSP/uC VOICE BAND AUDIO CODEC

29 Pages页,231K 查看

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